Aluminum nitride thermal conductive ceramic sheetIt has excellent thermal conductivity (5-10 times of alumina self porcelain), low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance, and similar thermal expansion coefficient with silicon, widely used in sub communication devices, high brightness LED, power electronic devices and other industries.

General dimensions of AlN thermal conductive ceramic substrates

 

Dimension of AlN thermal conductive ceramic substrate

Note: other special specifications can be laser processed or customized according to customer requirements.

Aluminum nitride thermally conductive ceramic product processing form

1. According to customer's requirements, the surface metallized gold, silver, copper and other metals can be made, and its heat conduction effect is better.

2. Conventional ceramic products can be polished (single or double-sided polishing is possible). The surface finish after polishing is Ra: 0.02-0.05 μm, and there are no holes.

3. Other processing methods can be processed according to customer's drawing requirements.

Aluminum nitride thermal conductive ceramic product processing form

1. Mold processing: All products except laser processing need mold processing.

2. Laser processing products: According to customer requirements, laser products (aluminum nitride, alumina, zirconia, etc.) are used for scribing, punching and cutting. The minimum hole diameter for laser drilling is 0.05mm, and the laser cutting thickness is less than 2mm. Its products have high processing accuracy and good repeatability.

氮化铝导热陶瓷产品应用
氮化铝导热陶瓷基板广泛应用于混合集成电路互连基板、 微波器件、 光电通信、 传感器、 MCM等领域。包括光电器件基板、陶瓷载体、激光器载体、片式电容、片式功率分配器、传感器、又指电容和螺旋电感等。

氮化铝导热陶瓷产品性能主要参数表